doc. no : qw0905-l rev. : date : data sheet la295b/g-pf led array ligitek electronics co.,ltd. property of ligitek only 14 - mar. - 2008 a295b/g-pf a lead-free parts pb
0.5 typ 1.5max 7.65 25.0min 1.0min 2.54typ + - 4.75 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg3130-pf part no. package dimensions page ligitek electronics co.,ltd. property of ligitek only la295b/g-pf 1/5 4.5 0.5 5 0.5 6.0 4.6 3.0 0.5 6.0 2.54typ + - 6.0 0.5 7.9 0.5typ
2/5 page ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. viewing angle 2 1/2 (deg) 46 min. 20 min. forward voltage @ ma(v) max. lens peak wave length pnm spectral halfwidth nm 20 1.72.6 30 565 luminous intensity @10ma(mcd) 30 typ. emitted part no material green la295b/g-pfgap green diffused color unit ma ma a mw 30 120 g ratings 10 ir -40 ~ +85 -40 ~ +100 100 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation symbol t opr tstg i f pd i fp part no. la295b/g-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 3/5 part no. la295b/g-pf
la295b/g-pf part no. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 25 0 0 time(sec) 250 2 /sec max preheat 100 200 temp( c) 120 260 260 c3sec max 5 /sec max page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only 60 seconds max
la295b/g-pf part no. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reference standard description page ligitek electronics co.,ltd. property of ligitek only 5/5
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